IBM and AMD have detailed their progress in 65-nm technology

IBM and AMD have detailed their progress in 65-nm technology, in which they have successfully combined embedded SiGe with Dual Stress Liner and Stress Memorization technology on SOI wafers, resulting in a 40 percent increase in transistor performance compared to similar chips produced without stress technology, while controlling power consumption and heat dissipation. The two have also announced that they are broadening and extending their technology alliance, adding early-stage research on critical, emerging technologies targeted at 32 and 22 nm, through 2011.

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