Soitec has announced the acquisition of TraciT Technologies


Soitec has announced the acquisition of TraciT Technologies. A CEA-Léti spin-off, TraciT specializes in thin-film layer transfer technologies that leverage molecular adhesion and mechanical and chemical thinning processes for MEMS and power-circuit production. The technology is complementary to Smart Cut,™ and enables Soitec to enter new electronic markets, thanks to fully-processed electronic circuits transfer technology, which has short-term applications for wafer-level packaging.

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