X-FAB Semiconductor Foundries AG has announced XT06

X-FAB Semiconductor Foundries AG has announced XT06, its new 0.6 µm SOI CMOS technology with trench isolation, which reduces die size by up to 40% and makes SOI cost competitive with bulk CMOS technology. XT06 technology is targeted at power management, automotive, optical, industrial and other applications that can benefit from smaller die size, less-complex circuit design with fewer loops, higher speed and lower power consumption, the company says.

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