With the upcoming Hybrid Memory Cube (HMC) from Micron et al, SOI becomes an integral part of 2.5D and 3D stacks, notes SemiMD’s Ed Sperling.


With the upcoming Hybrid Memory Cube (HMC) from Micron et al, SOI becomes an integral part of 2.5D and 3D stacks, notes SemiMD’s Ed Sperling. “The logic base layer—in this case made by IBM—uses an SOI substrate,” he explains, “…even if some of the other pieces use different materials.” He goes on to say that while the next-gen HMC enters production at the end of next year, in the meantime the existing HMC architecture can be attached to FPGAs, either in a vertical stack or in a 2.5D configuration. “Having an additional layer of insulation is a bonus in that architectural arrangement, as well, to buffer against a variety of physical effects ranging from noise to heat.”

Leave a Reply

Your email address will not be published. Required fields are marked *