Peregrine Ships 2 Billionth UltraCMOS Chip, Signs with GlobalFoundries, Celebrates 25 Years of RF-SOI

Peregrine Semi's new UltraCMOS 10 RF-SOI technology platform gives smartphone manufacturers unparalleled flexibility and value without compromising quality for devices ranging from 3G through LTE networks.(Photo: Business Wire)
Peregrine Semi’s new UltraCMOS 10 RF-SOI technology platform gives smartphone manufacturers unparalleled flexibility and value without compromising quality for devices ranging from 3G through LTE networks. (Photo: Business Wire)

Peregrine Semiconductor announced that it has shipped its 2 billionth chip, released version 10 of its UltraCMOS RF-SOI technology, and is working with GlobalFoundries.

UltraCMOS technology is an advanced RF-SOI process, the latest versions of which leverage bonded silicon-on-sapphire (BSOS) substrates from Soitec. Peregrine did an excellent article for ASN last spring, clearly explaining the use of sapphire as a highly insulating substrate for RF-SOI CMOS processing.

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