Boost for SOI Wafer Supply Chain: Soitec, SunEdison End Legal Feud, Agree on Patent Cross-Licencing

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Good news for the SOI ecosystem: SOI wafer suppliers Soitec and SunEdison (formerly MEMC) have ended their longstanding legal feud and entered into a patent cross-license agreement (press release here).  The agreement provides each company with access to the other’s patent portfolio for SOI technologies and ends all their outstanding legal disputes.

For Soitec, it represents a milestone for the SOI ecosystem, said Christophe Maleville, SVP of the company’s Digital Electronics Division.

For SunEdison, it adds to the company’s current SOI product capability, said Horacio Mendez, VP of the company’s Semiconductor Advanced Solutions division.

The agreement covers wafers for device architectures such as partially-depleted SOI (PD-SOI), fully-depleted SOI (FD-SOI) and radio-frequency SOI (RF-SOI) as well as advanced FinFETs.

The two companies have also agreed to grant each other the right to use their respective wholly-owned patents for research and development purposes. This applies to the development of products with advanced semiconductor materials beyond silicon that enable the fabrication of high-mobility channels for advanced generation digital applications.

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