MIT-Singapore Alliance Get EVG Bonder


EVG850LTlores

Equipment maker EVG announced that the Singapore-MIT Alliance for Research Technology (SMART) ordered an EVG®850LT fully automated production bonding system designed for SOI and direct wafer bonding using low-temp plasma activation processing (press release here). SMART researchers will use the system to support  advanced substrate development efforts.  According to Professor Eugene Fitzgerald from MIT’s Department of Materials Science and Engineering, SMART chose the EVG850LT for the center’s advanced R&D efforts due to the system’s high process flexibility and performance, EVG’s experience in low-temperature bonding, and expertise and support in process development.

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