A year after announcing the industrialization of CEA-Leti’s breakthrough M&NEMS technologies, Tronics has successfully designed and manufactured the first batch of six-degrees-of-freedom (6DOF) MEMS chips, with 3 accelerometers and 3 gyroscopes on a single die (press release here). Built on SOI wafers, with a die size of less than 4mm2, this 6DOF MEMS chip is one of the smallest in the industry, and Tronics says further optimization will make it the smallest. Besides its size advantage, the piezoresistive nanowire based technology significantly decreases power consumption and allows manufacturing of all sensor types (accelerometers, gyroscopes, magnetometers, pressure sensor and microphone) using a common process flow.
This first functional batch is an important milestone towards high volume production. The industrialization work will continue through 2014, with the first commercial samples available in Q4 2014. An ASIC is also being designed and will be available in 2014 to complete the sensor platform. In addition to the 6DOF device, Tronics has also designed a very compact 9DOF monolithic MEMS. Samples will be available by the end of this year.
Target applications for this new generation of inertial devices are those where size and/or power are key: wearable devices, smartphones and tablets.