IBM Foundry Solutions announced a new SOI-based technology for RF called 7SW SOI. The company says it is designed for 30 percent better performance than its predecessor, 7RF SOI, with which IBM shipped over seven billion chips in the last three years. The new mobile phone chip technology can help device manufacturers provide consumers with extremely fast downloads, higher quality connections, and longer battery life than its highly successful predecessor, says an IBM spokesperson. The new technology is designed to take advantage of more frequency bands, taking phone manufacturers one step closer to the reality of creating a “world phone” that can be used anywhere.
Here are the key points:
- The new technology gives designers added flexibility, enabling them to develop chips that integrate more function or that take up to 30 percent less space, depending on design goals.
- The new technology is a hybrid 180nm/130nm technology base and devices optimized to accommodate aggressive LTE standards and demanding worldwide coverage requirements
- It is optimized for multi-band switching in next-generation smartphones.
- Poised to drive innovation in newer category of smart devices in the Internet of Things as the new technology is an ideal fit for high-band LTE and Wi-Fi 5.8 GHz band applications.
- Clients can exploit the technology advances offered by 7SW to develop solutions that enhance user experiences, including broader geographic mobility and faster data rates for high definition video.
For a helpful brochure on IBM’s RF foundry offerings, click here.