Leti’s M3D, now dubbed “CoolCube”, featured in EETimes


Leti's M3D technology is now called "CoolCube". (Courtesy: Leti, IEDM 2014)
Leti’s M3D technology is now called “CoolCube”. (Courtesy: Leti, IEDM 2014)

Leti’s monolithic 3D technology, which has now been dubbed “CoolCube”, was featured in a recent EETimes piece.  Entitled True 3D monolithic integration eliminates TSV dependence (click here to read it), the article covers a Leti paper presented during a 3D-VLSI workshop preceding IEDM ’14.  Leti’s Advanced CMOS lab manager Maud Vinet detailed the “cool” process in an FPGA, stacking a 14nm FD-SOI logic layer on top of a memory layer. It eliminates the need for TSVs, shrinks area by 55%, cut power in half and increases speed by 30%, effectively gaining a full node in terms of power and performance.

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