Paul Boudre has been named CEO of SOI wafer leader, Soitec (see financial press release here). The company also announced its plans to re-focus on its core electronics business unit.
Q3 sales were 48 million euros, up 45% over last year. The sale of 200mm wafers (which are used in chips for RF-SOI and smartpower) were almost doubled from last year, and now represent three quarters of the company’s wafer sales. 300mm wafers (which are used for partially and fully-depleted SOI logic) were up by 16%. The company expects to see the ramp for 300mm FD-SOI wafers in H2 2015.
Boudre joined Soitec from KLA-Tencor in 2007. He has served as the company’s COO since 2008. He now takes over the CEO role from the company’s founder, André-Jacques Auberton-Hervé, who will continue as Chairman of the Board.
Soitec is restructuring its solar business and implementing cost-cutting measures.