FD-SOI at DAC 2016

53dac_logo_smallIf you’re headed to DAC (June 5-9 in Austin,TX) and are interested in learning more about FD-SOI, there will be lots of opportunities. Here’s a quick rundown.

Synopsys-GlobalFoundries: Dinner!

Synopsys (stands 149 & 361) and GlobalFoundries are hosting a dinner on Tuesday evening (7 June) at the Austin Hilton around the theme, What’s Important for IoT—Power, Performance or Integration… or All of the Above? They’ll be talking about how FD-SOI addresses these challenges. Panel members will discuss design techniques to push the envelope on low power, low leakage, burst performance and optimal cost to enable the design of innovative IoT-based products. Attendance is free, but registration is required and seating is limited. Click here to go to the registration site.

Samsung Foundry – Showcasing 28FDS

Samsung Foundry (stands 607 and 706) and partners will be doing a number of presentations on Samsung’s 28nm FD-SOI offering, 28FDS. They’ll be showcasing 28FDS wafers, offering multiple presentations by Samsung Foundry’s experts, and sharing solutions built on the 28FDS technology by their Foundry Ecosystem partners. As noted in ASN coverage of the recent SOI Consortium event in San Jose (read it here), Samsung is now in commercial production of 28FDS. They have a strong 28nm FD-SOI tape-out pipeline for 2016, and interest is rising fast.

Panels & Presentations

IP Track: Minimizing SOC Power Consumption: A Top Down Design Methodology or Bottoms Up Starting With the Process Selection Problem? Panelists include Carlos Mazure (of the SOI Industry Consortium & Soitec) and Ron Martino (of NXP) Monday, June 6th from 4:00pm – 5:00pm in Ballroom G.

Variation-Aware Design at Advanced and Low-Power Processes. Panelists include Azeez Bhavnagarwala (ARM), Glen Wiedemeier (IBM), John Barth (Invecas) and Jeff Dyck (Solido). Monday, June 6th from 10:30am – 11:30am, Room: 9BC.

Presentation 9.1 Impact of Leakage & biasing on Power in 22FDX Process. By Krishnan Subramanian et al (Invecas) and Sankar Ramachandran – (Apache Design). Monday, June 6th, 3:30pm – 4:00pm, Ballroom G.

Presentation 50.4 Leveraging FDSOI through Body Bias Domain Partitioning and Bias Search. By Johannes M. Kuehn et al (Eberhard Karls Univ. Tubingen & Keio Univ.) Wednesday, June 8th, 1:30pm – 3:00pm, Room: 17AB. This presentation will be given at 2:15. (You can also get the paper from the ACM site here.)

101.12 Parametric Exploration for Energy Management Strategy Choice in 28nm UTBB FDSOI Technology. By Jorge Rodas et al (CEA-Leti Minatec & Univ. Grenoble Alpes) Work-in-Progress (WIP) poster session, Wednesday, June 8th, 6:00pm – 7:00pm, Room: Trinity St. Foyer

Stands & More

Cadence Theater (stand 43 – full schedule here)

Tuesday, June 7th

  • 1:00pm – Opening a New Dimension in Design with GlobalFoundries 22FDX Technology (presented by GlobalFoundries)
  • 5:00pm – Ultra-Low Voltage SRAM: Addressing the Characterization Challenge (presented by SureCore – see their recent ASN piece here)
  • 5:30pm – Announcing Global MEMS Design Contest (presented by X-Fab – so not FD-SOI, of course, but they’ve got leading-edge, SOI-based solutions for MEMS, analog/mixed-signal and more. Read the interview in ASN here)

Wednesday, June 8th

  • 3:00pm – Analog and Mixed-Signal Design with GlobalFoundries 22FDX Technology (presented by GlobalFoundries)

Leti (stand 1818) – a driving force behind all things SOI, stop by to learn more about Silicon Impulse®, their FD-SOI platform for IoT & ultra-low-power (ULP) apps that helps start-ups, SMEs and large companies evaluate, design, prototype & move to volume (more here).

CMP (stand 343) – they’ve been delivering multi-project wafer runs of 28nm FD-SOI for a few years now (as seen in ASN here).

And finally, the opening keynote on Monday morning (at 9:15 in Ballroom A) will be given by NXP’s Lars Reger, CTO of their Automotive Business Unit. The topic is Revolution Ahead – What It Takes to Enable Securely Connected, Self-Driving Cars. When it comes to automotive, NXP is the original SOI pioneer, dating to back to 1999. NXP’s sold billions of SOI-based chips for high-voltage automotive applications – they’re used by virtually every carmaker on the planet (read about the early history here and here).

And now with the Freescale acquisition, NXP is full speed ahead with FD-SOI applications processors. If you missed it, you’ve got to read the recent ASN series by Ron Martino (NXP’s VP for i.MX Applications Processor and Advanced Technology Adoption). He explains why they chose 28nm FD-SOI, and exactly what it does for the i.MX 7 series (32-bit ARM v7-A core, targeting the general embedded, e-reader, medical, wearable and IoT markets) and i.MX 8 series (64-bit ARM v8-A series, targeting automotive applications, especially driver information systems, as well as high-performance general embedded and advanced graphics applications) Click here to read it now. NXP gave a demo of the I.MX 8 at FTF 2016 a few weeks ago – check out the video they posted on Twitter here.

If you go to DAC and you have a Twitter account, be sure to tweet #FDSOI and #53rdDAC – @followASN will be happy to pass it along!

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