As noted on the Lattice website, their business is to provide “… smart connectivity solutions powered by our low power FPGA, video ASSP, 60 GHz millimeter wave, and IP products to the consumer, communications, industrial, computing, and automotive markets worldwide.” And at their last Analyst and Investor Day, Lattice CEO Darin Billerbeck did a brilliant job explaining their strategy of targeting the “new edge”, where IoT devices really live.
At EW, David Manners talked to Lattice COO Glen Hawk, who told him they’re moving all their new products to 28 nm FD-SOI over the next couple of years. Manners says they benefit from the “…flexibility, low-power and low-cost of FD-SOI”. (Read the full article here.)
A Lattice spokesperson told Peter Clarke at EENewsAnalog that, “Lattice will be migrating to 28 nm FDSOI for new products, which we believe will enable us to achieve 10x lower power with the highest performance devices for edge connectivity and edge computing applications. Existing products will remain on their existing nodes and foundries.” (Read the full article here.
And over at EE Journal, Kevin Morris spent a day at Lattice. Rather than copy the traditional FPGA companies that are going for the high end with advanced FinFET processes, he explains, “Lattice uses FD-SOI processes to milk out the most performance possible with the tiniest power budgets and lowest device cost.” The result he predicts is that, “Lattice will own the edge where pennies and millimeters and microwatts are at a premium.” (Read the full article here.)