Industry 1st and It’s on FD-SOI: ARM’s eMRAM Compiler IP for Samsung’s 28FDS


Per Arm, the industry’s first eMRAM compiler IP is now on Samsung’s 28nm FD-SOI technology. The announcement was made in a post by Kelvin Low, VP Marketing for ARM’s Physical Design Group (read it here). He said that ARM has successfully completed their first eMRAM IP test chip tapeout. The Arm eMRAM compiler IP will be available from 4Q 2018 for lead partners.

Samsung Foundry’s 28nm FD-SOI process technology is called 28FDS. eMRAM (which stands for embedded MagnetoResistive RAM) is a novel non-volatile memory (NVM) option positioned to replace incumbent NVM eFLASH, which has hit its limits in terms of speed, power, and scalability.

Arm’s new eMRAM compiler IP gives Samsung’s 28FDS customers the flexibility to scale their memory needs based on the complexity of various use-cases, explains Low. “What drives the cost-effectiveness of this compiler IP is that eMRAM can be integrated with as few as three additional masks, while eFlash requires greater than 12 additional masks at 40nm and below,” he says. “Also, the eMRAM compiler can generate instances to replace Flash, Electrically Erasable Programmable Read-Only Memory (EEPROM) and slow SRAM/data buffer memories with a single non-volatile fast memory – particularly suited for cost- and power- sensitive IoT applications.”

A key slide shown by Arm at the 2017 SOI Consortium’s Silicon Valley Symposium (Courtesy: Arm and the SOI Consortium)

At the SOI Consortium’s 2017 Silicon Valley Symposium, Arm said that they were stepping up their support of FD-SOI (read about that here) – and clearly they are! At that event, Arm VP Ron Moore gave a great presentation, which is freely available on our website: Low Power IP: Essential Ingredients for IoT Opportunities.

Samsung, btw, has been offering 28FDS for about three years now. (ASN did a 3-part interview with Kelvin Low back in 2015 when he was a senior director of marketing for Samsung Foundry. It’s still a useful read – you can get it here.) As of last fall, Samsung said it had taped out more than 40 products for various customers. And at the SOI Consortium’s 2018 Silicon Valley Symposium, Hong Hoa, SVP said they’d already taped out another 20 this year (read about that here).

Samsung says the write speed of their eMRAM is 1000x faster than eFlash. They actually announced the industry’s first eMRAM testchip tape-out milestone on 28FDS in September 2017 (you can read the press release here). They also did an eMRAM test chip with NXP. (BTW, Samsung has a really nice video explaining their eMRAM offering – you can see it above or on YouTube here.)

As noted in ASN’s Silicon Valley 2018 symposium coverage, the basic PDK for the Samsung 18nm FD-SOI process (18FDS) will be available in September 2018, with full production slated for fall of 2019. It will deliver a 24% increase in performance, a 38% decrease in power, and a 35% decrease in area for logic. RF for the 18FDS platform will be ready by the end of this year, and eMRAM beginning in 2019.