SOI Visionary Sorin Cristoloveanu Receives IEEE 2017 Andrew Grove Award

Sorin Cristoloveanu has been named the 2017 recipient of one of the IEEE’s highest honors, the Andrew Grove Award, for his “contributions to silicon-on-insulator technology and thin body devices.” An IEEE Fellow and highly regarded figure in the SOI community, Sorin is the Director of Research at the French National Center for Scientific Research (CNRS […]

FD-SOI Training: Over 220 Attend 1st SOI Academy in Shanghai

There were over 220 participants at the recent SOI Academy FD-SOI Training event organized in Shanghai. The event extended over two days, with the first day covering a basic introduction to the technology as well as the ecosystem worldwide and in China. The second day was hands-on professional training. Attendees got a comprehensive understanding of […]

EuroSOI-ULIS (April 2019, Grenoble) – 1st Call for Papers

The organizing committee of the EuroSOI-ULIS conference, which will be held in Grenoble on the 1st-3rd of April 2019, has issued a first call for papers. The deadline is 15 January 2019. Here are the submission guidelines, and here is a poster you can share with colleagues. If you’ve never been, you should put it […]

Leti: Adding Strain to FD-SOI for 20nm and Beyond

Work at Leti shows that strain is an effective booster for high-performance at future nodes. The outstanding electrostatic performance already reported for planar FD-SOI technology can be improved by the use of ION boosters in order to target-high performance applications, as already demonstrated in the past. As illustrated in Figure 1, strain can be incorporated […]

IEEE SOI Conference

October 2008, New Paltz, NY, USA Researchers from the world over gathered at the beautiful Mohonk Mountain House in upstate New York this fall to listen to over 50 excellent presentations. Hot topics included memory, reliability and optimization. A selection of some of the best follows below, with links embedded for easy access to the […]

Conference Proceedings

• Formation of III-V Semiconductor Engineered Substrates Using Smart CutTM Layer Transfer Technology Fabrice Letertre, in Advances in GaN, GaAs, SiC and Related Alloys on Silicon Substrates, edited by A. Dadgar, T. Li, M. Mastro, E.L. Piner, and J. Redwing (Mater. Res. Soc. Symp. Proc. Volume 1068, Warrendale, PA, 2008). • Direct Growth of III-V […]

Other papers

• Impact of the transient formation of molecular hydrogen on the microcrack nucleation and evolution in H-implanted Si (001) S. Personnic, K. K. Bourdelle, F. Letertre, A. Tauzin, N. Cherkashin, A. Claverie, R. Fortunier and H. Klocker, J. Appl. Phys. 103, 023508 (Jan. 2008). • Thermally Processed High-Mobility MOS Thin-Film Transistors on Transferable Single-Crystal Elastically […]

Books & Journals

SOI Materials and Devices, S. Cristoloveanu and G. K. Celler, Chapter 4 of Handbook of Semiconductor Manufacturing Technology, 2nd edition, edited by R. Doering and Y. Nishi (CRC Press, Taylor and Francis Group, Boca Raton, Fl, 2007), pages 4-1 to 4-52 Low temperature diffusion of impurities in hydrogen implanted silicon, S. Personnic, K. K. Bourdelle, […]

Conference Proceedings

International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) (April 2007): Multi-Gate MOSFETs with Dual Contact Etch Stop Liner Stressors on Tensile Metal Gate and Strained Silicon on Insulator (sSOI), Che-Hua Hsu, Weize Xiong, Chien-Ting Lin, Yao-Tsung Huang, Mike Ma1, C.R Cleavelin, Paul Patruno, Mark Kennard, Ian Cayrefourcq, Kyoungsub Shin, Tsu-Jae King Liu (UMC, Texas […]

10 Years – Already?

One of the world’s leading SOI experts considers Smart Cut innovations and future potential. I remember a meeting with a PhD student, over ten years ago. He was supposed to work on SIMOX material: at that time, a perfect topic in a perfect SIMOX group with Michel Bruel, André Auberton and Jean-Michel Lamure around. Oddly, […]