In addition to announcements of extensions of its existing platforms, AMD issued its SOI roadmap news (by codename). Plans for 2010 include: • “Danube” – mainstream notebook platform featuring the first AMD mobile quad-core processors; • “Nile” – ultrathin notebook platform. • “San Marino” and “Maranello” – 8- and 12-core processors for the volume server […]
NXP has launched the UBA2024 and UBA2024A integrated half-bridge power ICs, based on the company’s EZ-HV SOI technology. They enable the easy design of low-cost, very compact, high-reliability, long-life florescent lamp (CFL) applications.
The MOSIS Service, a leading provider of semiconductor fabrication solutions, has expanded its relationship with IBM to 45nm SOI for System-on-Chips (SOCs) and 180nm 7RF SOI for RF switches. This provides a low-cost route to prototyping and low-volume production.
Under a 5-year agreement, CEA-Leti and IBM will collaborate on semiconductor and nanoelectronics technology research for 22nm and beyond. CEA/Leti, which becomes a research associate of IBM and IBM’s semiconductor Joint Development Alliance ecosystem centered in Albany, N.Y., will reinforce this ecosystem through its specific expertise in low-power, SOI-based CMOS.
GlobalFoundries Open for Business GlobalFoundries, a joint venture between AMD and the Advanced Technology Investment Company (ATIC) has been officially launched. In addition to manufacturing chips for AMD, the new foundry opens the door for a wide range of chip companies to gain early access to volume chip production using leading-edge technologies. The Dresden cluster, […]
The Intel research results published in Nature Photonics regarding world-record performance using a silicon-based Avalanche Photodetector (APD) describes continued work on SOI (as detailed in ASN#8). Intel says this opens the door to lowering the cost of optical links running at data rates of 40Gbps or higher and proves, for the first time, that a […]
New from AMD (which builds all its 64-bit microprocessors on SOI): • the four-core Phenom™ II X4 (up to 3GHz) and Black Edition (3.2GHz) and the triple-core Phenom™ II X3 (up to 2.8GHz) on 45nm SOI, which are at the heart of the “Dragon” platform (with headroom for overclocking), targeting demanding gaming and consumer applications; […]
Qcept Technologies’ ChemetriQ® 3000, a new breed of non-visual defect (NVD) inspection systems, has been adopted by Soitec, the leading SOI wafer supplier. The ChemetriQ system is being used for incoming quality control of bare silicon wafers and process monitoring of SOI wafers. The two companies have agreed to collaborate on ongoing application development.
The IEEE has conferred the Cledo Brunetti Award on Dr. Michel Bruel. At a ceremony at the IEDM in San Francisco, the IEEE Board of Directors gave the 2008 Cledo Brunetti Award to Dr. Michel Bruel for his invention of the Smart Cut™ layer transfer technology that enabled widespread adoption of SOI for CMOS circuits. […]
Announcements in worldwide and Asia sales; China distribution. Soitec, the world’s leading supplier of engineered substrates, has announced key appointments to its sales team and finance department, and a new distribution partnership for markets in China.