GF Triples FDXcelerator Partner Base in 1st Year

As of September 2017, GlobalFoundries’ FDXcelerator program now counts 21 members. Its purpose is to extend the reach of the FD-SOI ecosystem, creating an open framework that allows these selected partners to integrate their products or services into a validated, plug-and-play catalog of design solutions. The program was first launched with seven partners in September […]

Samsung Certifies Synopsys Custom Design Platform for 28nm FD-SOI

Synopsys’ custom design platform has been certified by Samsung Electronics for its 28FDS (FD-SOI) process technology. The certified Synopsys custom design platform includes HSPICE® golden-accuracy circuit simulation, Custom Compiler™ visually-assisted layout automation, StarRC™ gold-standard parasitic extraction and IC Validator scalable physical signoff. The Synopsys custom design platform provides improved custom and mixed-signal design productivity for […]

GlobalFoundries, Verisilicon putting 1st complete IoT modem on single FD-SOI chip

Leveraging GF’s 22FDX® FD-SOI technology, GlobalFoundries and Verisilicon are developing IP to enable a complete cellular modem module on a single chip, including integrated baseband, power management, RF radio and front-end module combining both Narrowband IoT (NB-IoT) and LTE-M capabilities. (Read the full press release here.) The new approach is expected to deliver significant improvements […]

$100M+ investment for FDX™ FD-SOI Chengdu design center of excellence

GlobalFoundries  and the Chengdu municipality plan to build a world-class FD-SOI ecosystem including multiple design centers in Chengdu and university programs across China. They’ve announced an investment of more than $100 million, which is expected to attract leading semiconductor companies to Chengdu, making it a center of excellence for designing next-generation chips in mobile, IoT, […]

Samsung Announces Next FD-SOI Node: 18nm

Big News: Samsung has officially revealed that their next FD-SOI node is 18nm.  The announcement was made at the recent Samsung Foundry Forum, which showcased a number of new technologies that the company says will help enable the development of new devices connecting consumers in entirely new ways. (You can read the full press release […]

SOI Visionary Sorin Cristoloveanu Receives IEEE 2017 Andrew Grove Award

Sorin Cristoloveanu has been named the 2017 recipient of one of the IEEE’s highest honors, the Andrew Grove Award, for his “contributions to silicon-on-insulator technology and thin body devices.” An IEEE Fellow and highly regarded figure in the SOI community, Sorin is the Director of Research at the French National Center for Scientific Research (CNRS […]

Must Read! EETimes Covers NXP’s First FD-SOI Chips and FD-SOI Symposium

EETimes Editor Rick Merritt has posted an excellent piece entitled NXP Shows First FD-SOI Chips. He attended the SOI Consortium’s recent FD-SOI Symposium in Silicon Valley, and used the event to score interviews with key executives from NXP, Samsung and GlobalFoundries. The piece has generated a big buzz, having been shared several hundred times on […]

New Advanced NV Memory IP for FDSOI – Attopsemi Joins GF’s FDXcelerator Program

There’s a new memory IP specialist on board for the FDSOI ecosystem. Attopsemi Technology has joined GlobalFoundries’ FDXcelerator™ Partner Program (read the press release here). Attopsemi is ensuring that its scalable, non-volatile one-time programmable (OTP) memory IP is compatible with GF’s 22FDX® technology. Their leading-edge I-fuse™ OTP IP is a fuse-based OTP technology that can […]

Peregrine in volume shipping of UltraCMOS® 60 GHz RF SOI Switches

Peregrine Semiconductor recently announced immediate availability of volume production parts for their UltraCMOS® 60 GHz RF SOI switches. (Read the full press release here.) The PE42525 and PE426525 extend Peregrine’s high frequency portfolio into frequencies previously dominated by GaAs technology. Both 60 GHz switches deliver exceptional performance in all key RF parameters and have a […]

EuroSOI 2017 – 3-5 April in Athens

The 2017 Joint International EuroSOI Workshop and International Conference on Ultimate Integration on Silicon (ULIS) will be held April 3-5 in Athens, Greece. Although EuroSOI has been ongoing for many years, this marks the third year it joins forces with the ULIS conference. Sponsored by the IEEE and EDS, the goal is to create an […]