Tokyo SOI Workshop – Day 2 Recap (Part 1)

Day 2 of the recent SOI Workshop in Tokyo was dedicated to the “Convergence of IoT, Automotive through Connectivity”. Many of the presentations are now posted and freely available – click here to see the full list. It was a really full day, so the recap in this post covers about half of the Day […]

GlobalFoundries, Verisilicon putting 1st complete IoT modem on single FD-SOI chip

Leveraging GF’s 22FDX® FD-SOI technology, GlobalFoundries and Verisilicon are developing IP to enable a complete cellular modem module on a single chip, including integrated baseband, power management, RF radio and front-end module combining both Narrowband IoT (NB-IoT) and LTE-M capabilities. (Read the full press release here.) The new approach is expected to deliver significant improvements […]

We’re Doing It! FD-SOI Ecosystem Shines in Tokyo (Day 1)

The FD-SOI ecosystem is strong. This was made clear at the recent Tokyo SOI Workshop, organized by the SOI Consortium. The event was spread out over two days, and most of the presentations are now posted (click here to access them).   To cover the full scope of the workshop will take (at least) a couple […]

$100M+ investment for FDX™ FD-SOI Chengdu design center of excellence

GlobalFoundries  and the Chengdu municipality plan to build a world-class FD-SOI ecosystem including multiple design centers in Chengdu and university programs across China. They’ve announced an investment of more than $100 million, which is expected to attract leading semiconductor companies to Chengdu, making it a center of excellence for designing next-generation chips in mobile, IoT, […]

Samsung Announces Next FD-SOI Node: 18nm

Big News: Samsung has officially revealed that their next FD-SOI node is 18nm.  The announcement was made at the recent Samsung Foundry Forum, which showcased a number of new technologies that the company says will help enable the development of new devices connecting consumers in entirely new ways. (You can read the full press release […]

SOI Visionary Sorin Cristoloveanu Receives IEEE 2017 Andrew Grove Award

Sorin Cristoloveanu has been named the 2017 recipient of one of the IEEE’s highest honors, the Andrew Grove Award, for his “contributions to silicon-on-insulator technology and thin body devices.” An IEEE Fellow and highly regarded figure in the SOI community, Sorin is the Director of Research at the French National Center for Scientific Research (CNRS […]

Must Read! EETimes Covers NXP’s First FD-SOI Chips and FD-SOI Symposium

EETimes Editor Rick Merritt has posted an excellent piece entitled NXP Shows First FD-SOI Chips. He attended the SOI Consortium’s recent FD-SOI Symposium in Silicon Valley, and used the event to score interviews with key executives from NXP, Samsung and GlobalFoundries. The piece has generated a big buzz, having been shared several hundred times on […]