Event Url :

31st May – 1st June 2017: The Annual Tokyo SOI Workshop – Japan

Agenda Annual Tokyo SOI Workshop

PRESENTATIONS

During the one and a half day workshop, leading companies working in the domain of SOI based technologies were meeting together in Tokyo to discuss about SOI Ecosystem and “Convergence of IoT, Automotive through Connectivity”.

May 31st, 2017: FDSOI  Ecosystem @ Yokohama Landmark Tower

TCAD, EDA and IP to Support FDSOI –  David Dutton, CEO Silvaco (presentation to come)

FDX™ Goes Mainstream – Gregg Bartlett, SVP GlobalFoundries

INVECAS IP Portfolio in 22FDX – Bhaskar Kolla, Sr.Director Business Development and Customer Engineering, Invecas

FDSOI : A Low Power, High Performance Technology Scalable Down to 10nm Laurent Grenouillet, Expert, CMOS & Memory Integration, CEA-Leti

I-Fuse(tm): The Best OTP of Choice for FD-SOI and Sub-14nm Nodes – Shine Chung, Chairman, Attopsemi Technology

Product Design Methodology – Christophe Tretz, SOI Consortium

June 1st, 2017 , “Convergence of IoT, Automotive through Connectivity” @ Takeda Hall, Tokyo University, Tokyo

Ultra Low Power Applications

Sony Semiconductor Solutions , Low Power IoT Solution – Kenichi Nakano, General Manager, Sony IoT (presentation to come)

Technologies for Automotive

LIDARs and Sensor Fusion ECUs Advancing ADAS Architectures towards Automated Driving – Akhilesh Kona, Senior Analyst, IHS Markit

MIPS Leading Heterogeneous Compute in Automotive & IoT – Steven Yeung, Design Manager, MIPS, Imagination Technologies

Future of Automotive Industry – Road is Paved with SOI Vincent Roger, Corporate Business Developer, CEA-Leti

IoT – Connectivity – Infrastructure

Enabling An Interconnected Digital World Jonathan Smith, Director, Cadence (presentation to come)

Nokia Future X Network for 5G and IoTBrian Cho, Head of Technology for APAC & Japan, Nokia on infrastructure for 4G/5G

Delivering on the Promises of 5G: Semiconductor Solutions for the Next Wave of Data – Peter Rabbeni, Senior Director, GlobalFoundries (presentation to come)

Sensor-to-Cloud Connectivity Solution for IoT –  Hiroshi Noguchi, Director of AMG Product Marketing, STMicroelectronics

Supply Chain

Enabling SOI and IoT:  An Equipment and Materials Engineering Perspective – Sesh Ramaswami, Managing Director, Applied Materials (presentation to come)

SCREEN Equipment Manufacturer: Full participation within the SOI Consortium – Hirofumi Uchida, Senior VP, Screen

Role of Substrate in Accelerating Mass Adoption of SOI Technologies –Thomas Piliszczuk, EVP, Soitec (presentation to come)

Leave a Reply

Your email address will not be published. Required fields are marked *