Tag Archive 3D

NXP, Qualcomm, Skyworks to Keynote IoT Theme in Upcoming IEEE SOI-3D-SubVt (S3S) Conference (San Francisco, Oct.’16) – Late News Submissions Open, Advance Program Available

IEEE S3S Conference 10-13 October 2016 Hyatt Regency San Francisco Airport IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Confer

Reminder re: top SOI Conference – IEEE S3S ’16 (SOI/3D/SubVt) CFP deadline April 15th. Keynotes: NXP, Skyworks, Qualcomm

Don't forget to get your paper submitted to the top conference with a major focus on the SOI ecosystem: the IEEE S3S (SOI/3D/SubVt). The Call For

IEEE S3S, Top SOI/3D/SubVt Conference, Issues Call for Papers. Theme: Energy Efficient Tech for IoT. (Best Student Paper wins $1000)

The IEEE S3S (SOI/3D/SubVt) has issued its call for papers for the 2016 conference (click here for details). The theme of the conference, which w

Don’t miss EuroSOI-ULIS, 25-27 January 2016 in Vienna. Call for papers still open.

The 2016 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon, aka EUROSOI-ULIS 2016 will be t

Advanced substrates for 3D and other new markets drive new fab inspection equipment – interview with Altatech GM

New approaches in chipmaking and fast-evolving specialty markets are driving the need for new equipment on the fab floor. 3D chips (be they stack

Great line-up planned for IEEE S3S (SOI, 3D and low-voltage — 5-8 October, Sonoma, CA). Advance Program available. Registration still open.

Now in its third year, the 2015 IEEE S3S Conference has evolved into the premier venue for sharing the latest and most important findings in

IEEE SOI-3D-Subthreshold Conference (S3S, Oct. Sonoma, CA) Welcoming Papers til mid-May

The IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (IEEE S3S) will be held in Sonoma Valley, CA 5-8 October 2015. (Phot

Interview (Leti): How a new platform helps designers get the most out of FD-SOI for IoT, ULP

CEA-Leti Clean Room (© Pierre Jayet) A driving force in FD-SOI, Leti recently announced a service called Silicon Impulse®, a new FD-SOI pla

2015 – Turning the Tables for FD-SOI, RF-SOI and More

If current momentum is any indication, 2015 will be the year the tables turn in favor of FD-SOI designs (with a big shout-out to IoT).  The RF-S

IEEE SOI-3D-Substhreshold (S3S) Conference Issues Call for Papers

The IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (IEEE S3S) has issued the 2015 Call for Papers. Now in its 3rd ye