ISSCC 2011

Website: http://isscc.org 20-24 February 2011, San Francisco, CA ISSCC – the International Solid-State Circuits Conference – is the flagship conference of the Solid-State Circuits Society. It is widely considered the premier forum for presenting advances in solid-state circuits and systems-on-a-chip. Here is a round-up of this year’s major SOI-based papers. Session 4: Enterprise Processors & […]

AMD’s New Fusion APU’s on 32nm SOI

The AMD PR folks are calling their new Fusion APUs the era of  “Personal Supercomputing”  – and its flagships are on 32nm SOI   We’ve been hearing about these revolutionary chips for years now – the “Fusion” of graphics chips – GPUs – and CPUs on a single piece of silicon, which they’re referring to as […]

In addition to announcements of extensions of its existing platforms, AMD issued its SOI roadmap news (by codename)

In addition to announcements of extensions of its existing platforms, AMD issued its SOI roadmap news (by codename). Plans for 2010 include: • “Danube” – mainstream notebook platform featuring the first AMD mobile quad-core processors; • “Nile” –  ultrathin notebook platform. • “San Marino” and “Maranello” – 8- and 12-core processors for the volume server […]

New 45nm chips from AMD

New 45nm chips from AMD (which builds all its 64-bit microprocessors on SOI): • Athlon™ II X2 250 processor for mainstream consumers and the Phenom™ II X2 550 Black Edition processor, the first ever dual-core AMD Phenom II CPU. • the Six-Core AMD Opteron™ processor family, to address rising demand for increased performance balanced by […]

New from AMD

New from AMD (which builds all its 64-bit microprocessors on SOI): • the four-core Phenom™ II X4 (up to 3GHz) and Black Edition (3.2GHz) and the triple-core Phenom™ II X3 (up to 2.8GHz) on 45nm SOI, which are at the heart of the “Dragon” platform (with headroom for overclocking), targeting demanding gaming and consumer applications; […]

Breakthroughs at the IEDM

The IEEE’s International Electron Devices Meeting (IEDM) is the world’s showcase for the most important applied research breakthroughs in transistors and electronics technology. Here are a few highlights from some of the papers that presented advances in SOI-based devices and architectures at the most recent meeting (December 2008, San Francisco).

From AMD

From AMD (which builds all its 64-bit microprocessors on SOI): • The new 45nm Quad-Core AMD Opteron™ (“Shanghai”) pushes performance up 35% and power consumption down 35%. • The newly announced Foundry Company will be in the IBM technology development alliance for both SOI and bulk technology.

IBM

IBM: • IBM has licensed the multi-protocol SerDes cell from Rambus for high-performance and low-power 45nm SOI. • For the most challenging arithmetic operations, IBM’s new PowerXCell™ 8i (65nm SOI) offers five-times the speed of the original Cell/B.E. processor. • The “Roadrunner” supercomputer at Los Alamos shot to #1 on the TOP500™ Supercomputer list with […]

AMD (which builds all its 64-bit microprocessors on SOI)

AMD (which builds all its 64-bit microprocessors on SOI): • An AMD spokesperson has confirmed that the first Fusion (CPU/GPU) chip, designed by a worldwide team, is on SOI and will be manufactured in Dresden. • The new Turion X2 Ultra Dual-Core Mobile doubled notebook design wins.

Recent Conference Proceedings

International SiGe Technology and Device Meeting (ISTDM) May 2008, Hsinchu, Taiwan • Defect Delineation and Characterization in SiGe, Ge and other Semiconductor-on-insulator Structures. (Invited) Alexandra Abbadie, F. Allibert, F. Brunier (Soitec) • Performance and Scaling of cMOSFETs on Ultra-Thin Strained SOI. (Invited) Francois Andrieu, V. Barrel, T. Poiroux, O. Faynot, S. Deleonibus (CEA-LETI Minatec) • […]