FD-SOI at DAC 2016

If you’re headed to DAC (June 5-9 in Austin,TX) and are interested in learning more about FD-SOI, there will be lots of opportunities. Here’s a quick rundown. Synopsys-GlobalFoundries: Dinner! Synopsys (stands 149 & 361) and GlobalFoundries are hosting a dinner on Tuesday evening (7 June) at the Austin Hilton around the theme, What’s Important for […]

Shanghai & Grenoble tech dev powerhouses team up on SOI for IoT in China and global innovation ecosystem

Three of the world’s More-than-Moore and SOI technology development powerhouses have signed a comprehensive agreement for ongoing collaboration and cooperation in developing new technologies for the emerging IoT market. SITRI of Shanghai, and CEA-Leti and Minatec of Grenoble will work together to accelerate the adoption of their latest technologies and create a global innovation ecosystem […]

Silicon Valley FD-SOI Symposium Promises Best Ecosystem Line-Up Ever: ARM, Foundries, EDA, Designers, Experts & Users (13 April – free and open to all who sign up)

The SOI Consortium has lined up an excellent, comprehensive FD-SOI Symposium on April 13th in San Jose. They’ll be highlighting the tremendous progress of the FD-SOI ecosystem. Headliners include Cisco, Sony, NXP, SigmaDesigns, ARM, Ciena plus the big FD-SOI foundries, EDA companies, design partners, chipmakers and analysts. There is a special session dedicated to RF […]

To help designers assess 28nm FD-SOI power benefits, Keysight (formerly Agilent/HP test) adds more Leti-UTSOI modeling tech for SPICE

CEA-Leti has signed an agreement with Keysight Technologies (formerly the Agilent/HP test group), the industry-leading device-modeling software supplier, to adopt Leti’s UTSOI extraction flow methodology within Keysight’s device modeling solutions for high-volume SPICE model generation. (Read the press release here.) “This collaboration between Leti and Keysight will strengthen the global FD-SOI ecosystem by providing an […]

Leti Develops 22nm FD-SOI Local-strain Techniques to boost performance and lower power consumption

CEA-Leti announced it has developed two techniques to induce local strain in FD-SOI processes for next-generation FD-SOI circuits that will produce more speed or lower power consumption and improved performance. (For more details, read the press release here.) Targeting the 22/20nm node, the local-strain solutions are dual-strained technologies: compressive SiGe for PFETs and tensile Si […]

Leti joins GF’s GlobalSolutions, Providing FD-SOI ASIC Design-and-Fab Solutions on 22FDX

Tags: FD-SOI, Leti, GlobalFoundries, GF, 22nm, IoT, design, foundry, manufacturing Leti has joined the GlobalFoundries’ GlobalSolutions ecosystem as an ASIC provider, specifically to support GF’s 22FDX™ technology platform. (Read the press release here.) Earlier this year, Leti assigned a team of experts to GF’s’ Dresden Fab 1 to support ramp up of the platform. As […]