Silicon Valley FD-SOI Symposium Promises Best Ecosystem Line-Up Ever: ARM, Foundries, EDA, Designers, Experts & Users (13 April – free and open to all who sign up)

The SOI Consortium has lined up an excellent, comprehensive FD-SOI Symposium on April 13th in San Jose. They’ll be highlighting the tremendous progress of the FD-SOI ecosystem. Headliners include Cisco, Sony, NXP, SigmaDesigns, ARM, Ciena plus the big FD-SOI foundries, EDA companies, design partners, chipmakers and analysts. There is a special session dedicated to RF […]

To help designers assess 28nm FD-SOI power benefits, Keysight (formerly Agilent/HP test) adds more Leti-UTSOI modeling tech for SPICE

CEA-Leti has signed an agreement with Keysight Technologies (formerly the Agilent/HP test group), the industry-leading device-modeling software supplier, to adopt Leti’s UTSOI extraction flow methodology within Keysight’s device modeling solutions for high-volume SPICE model generation. (Read the press release here.) “This collaboration between Leti and Keysight will strengthen the global FD-SOI ecosystem by providing an […]

Leti Develops 22nm FD-SOI Local-strain Techniques to boost performance and lower power consumption

CEA-Leti announced it has developed two techniques to induce local strain in FD-SOI processes for next-generation FD-SOI circuits that will produce more speed or lower power consumption and improved performance. (For more details, read the press release here.) Targeting the 22/20nm node, the local-strain solutions are dual-strained technologies: compressive SiGe for PFETs and tensile Si […]

Leti joins GF’s GlobalSolutions, Providing FD-SOI ASIC Design-and-Fab Solutions on 22FDX

Tags: FD-SOI, Leti, GlobalFoundries, GF, 22nm, IoT, design, foundry, manufacturing Leti has joined the GlobalFoundries’ GlobalSolutions ecosystem as an ASIC provider, specifically to support GF’s 22FDX™ technology platform. (Read the press release here.) Earlier this year, Leti assigned a team of experts to GF’s’ Dresden Fab 1 to support ramp up of the platform. As […]

Industry 1st: Leti Demos MEMS on 300mm Wafers – And Yes, They’re SOI

In what may be a first for the MEMS industry, CEA-Leti has manufactured micro-accelerometers on 300mm wafers, a development that could lead to significantly lower MEMS manufacturing costs. And yes, those 300mm wafers are SOI wafers. These are “thick” SOI wafers, with an insulating BOx (buried oxide) layer of 2µm, and top silicon of 220nm. […]