A very successful two-day forum on FD-SOI and RF-SOI in Shanghai (September 2015) featured presentations from CEOs, CTOs and VPs at GF, ST, Leti, ARM, Verisilicon, Synapse Design, SITRI, Skyworks, Freescale, TowerJazz, Soitec, Qorvo and many more. Most of the presentations are now available on the SOI Consortium Website, and the rest are expected shortly, so keep checking back.
To download the “Design for FD-SOI” presentations, see the list here.
To download the “RF-SOI Workshop – Interconnected World” presentations, see the list here. (Presentations from all of the major SOI wafer suppliers are also available on this page.)
Qorvo recently announced that new high-performance SOI components are landing major wins at cellular base station manufacturers. (Read the press release here.) Ideal for broadband communications systems, the highly integrated components significantly reduce external components while lowering cost, power consumption, and weight in wireless infrastructure, test and measurement, and defense and aerospace applications. (Qorvo was formed following the merger of RFMD and TriQuint.)
“These new SOI components feature the broadband performance our customers expect from Qorvo’s products,” said Sumit Tomar, general manager of Qorvo’s Wireless Infrastructure business unit. “With exceptional linearity, robust power handling, and no external components, this portfolio is already in demand, even in the sampling stage.”