Peregrine in volume shipping of UltraCMOS® 60 GHz RF SOI Switches

Peregrine Semiconductor recently announced immediate availability of volume production parts for their UltraCMOS® 60 GHz RF SOI switches. (Read the full press release here.) The PE42525 and PE426525 extend Peregrine’s high frequency portfolio into frequencies previously dominated by GaAs technology. Both 60 GHz switches deliver exceptional performance in all key RF parameters and have a […]

EuroSOI 2017 – 3-5 April in Athens

The 2017 Joint International EuroSOI Workshop and International Conference on Ultimate Integration on Silicon (ULIS) will be held April 3-5 in Athens, Greece. Although EuroSOI has been ongoing for many years, this marks the third year it joins forces with the ULIS conference. Sponsored by the IEEE and EDS, the goal is to create an […]

SOI Consortium Welcomes ASN News

Changes are afoot on the SOI Consortium website. You’ve seen our great new look. Now we have also brought Advanced Substrate News (known to most as ASN) into our fold. ASN has been bringing you SOI-related news for over a decade now. Editor-in-Chief Adele Hars will continue leading the charge, working closely with the Consortium’s […]

GF FD-SOI: Fab for China, Expansion in Europe

SOI Consortium member GlobalFoundries is teaming up with the Chengdu municipality to build a fab in western China offering FD-SOI (see press release here). The partners plan to establish a 300mm fab to support the growth of the Chinese semiconductor market and to meet accelerating global customer demand for 22FDX®, GF’s 22nm FD-SOI process technology. […]

New Chips and Design Wins for RF-SOI Pioneer Peregrine Semi

From RF-SOI pioneer Peregrine Semi comes a steady stream of new chips and design wins. News include: Two UltraCMOS® MPAC–Doherty products—the PE46130 and PE46140 (press release here). These monolithic phase and amplitude controllers (MPAC) join the PE46120 in offering maximum phase-tuning flexibility for Doherty power amplifier (PA) optimization. Designed for the LTE and LTE-A wireless-infrastructure […]

GF’s New RF-SOI PDK Simplifies Design for Smartphones, IoT

GlobalFoundries recently announced availability of a new set of RF-SOI PDKs for the company’s 7SW SOI technology. GF, which has now delivered more than 20 billion RF-SOI chips for the world’s smartphones, tablets and more, notes that its 7SW SOI technology is optimized for multi-band RF switching in next-generation smartphones. It is also poised to […]

Shanghai & Grenoble tech dev powerhouses team up on SOI for IoT in China and global innovation ecosystem

Three of the world’s More-than-Moore and SOI technology development powerhouses have signed a comprehensive agreement for ongoing collaboration and cooperation in developing new technologies for the emerging IoT market. SITRI of Shanghai, and CEA-Leti and Minatec of Grenoble will work together to accelerate the adoption of their latest technologies and create a global innovation ecosystem […]