Over a hundred chip designers packed the room for the SOI Consortium’s recent FD-SOI Design Techniques Tutorial Day. Five professors and scientists from top institutions covered design techniques with real examples in digital, mixed-signal, analog, RF, mmW and ULV memory. Although it was in Silicon Valley, people actually flew in from all over the world […]
Tag: rf
Samsung Announces Next FD-SOI Node: 18nm
Big News: Samsung has officially revealed that their next FD-SOI node is 18nm. The announcement was made at the recent Samsung Foundry Forum, which showcased a number of new technologies that the company says will help enable the development of new devices connecting consumers in entirely new ways. (You can read the full press release […]
ARM Steps Up! And More Good News From Consortium’s FD-SOI Symposium in Silicon Valley
ARM is stepping up its effort to support the FD-SOI ecosystem. “Yes, we’re back,” confirmed Ron Moore, VP of ARM’s physical design group. This and much more good news came out of the recent FD-SOI Symposium organized in Silicon Valley by the SOI Consortium. The full-day Symposium played to a packed room, and was followed […]
Quick Preview of (Great!) FD-SOI Design Tutorial Day (14 April ’17, Silicon Valley)
Would you like to better understand FDSOI-based chip design? If you’re in Silicon Valley, you’re in luck. On April 14th, the SOI Consortium is organizing a full day of FDSOI tutorials for chip designers. This is not a sales day. This is a learning day. On the agenda are FD-SOI specific design techniques for: analog […]
NXP’s new i.MX 7ULP On 28nm FD-SOI – Yes! Industry’s Lowest Power General Purpose Applications Processor (part 1)
They’re calling it, “The most advanced, lowest power-consuming GPU-enabled MPU on the market.” It’s NXP’s new i.MX 7ULP general-purpose processor, and it’s on 28nm FD-SOI. They’ve got a nifty video summing it all up – you can watch it here. With the i.MX 7ULP, NXP is first to market with an FD-SOI applications processor offering […]
Part 2: NXP’s new i.MX 7ULP – More on Why It’s On 28nm FD-SOI
As you learned in Part 1 of this article, NXP is calling its new i.MX 7ULP general-purpose processor, “The most advanced, lowest power-consuming GPU-enabled MPU on the market.” Now let’s get into a little more detail about why it’s on 28nm FD-SOI. If you read NXP VP Ron Martino’s terrific, two-part ASN piece last year […]
12nm FD-SOI on the Roadmap for H1/2019 Customer Tape-out! Says GloFo (While Giving 22FDX Ecosys a Great Boost)
12nm FD-SOI has now officially joined the GlobalFoundries’ roadmap, targeting intelligent, connected systems and beating 14/16nm FinFET on performance, power consumption (by 50%!) and cost (see press release here). Customer product tape-outs are expected to begin in the first half of 2019. GloFo also announced FDXcelerator™, an ecosystem designed to give 22FDX™ SoC design a […]
Why Dan Hutcheson/VLSIresearch, Inc. (finally!) Likes FD-SOI
Dan Hutcheson, CEO of VLSIresearch, Inc. finally likes FD-SOI. That’s important, because he’s a really influential person in the chip world. Everybody who’s anybody in the chip biz pays attention to what VLSIresearch, Inc. has to say. Dan recently gave a talk entitled “FD-SOI: Disruptive or Just Another Process?” to a packed-to-the-brim room during the […]
RF-SOI – Foundries Weigh In On New 300mm Wafers for 4G/LTE-A, 5G and IoT. Plus a Look at the Innovation Pipeline – Part 2 of 2
As you may have read in the first part of this series, Soitec (the industry’s leading supplier of SOI wafers) says its 200mm RF-SOI wafers have been used to produce over 20 billion chips, and the company is now in high-volume manufacturing of a 300mm version of its wildly successful RFeSI line (see press release […]
Now also on 300mm wafers and headed for 5G and IoT, RF-SOI’s going strong and stronger (>20 billion chips to date) – Part 1 of 2
Soitec, the industry’s leading supplier of SOI wafers recently announced it’s in high-volume manufacturing of a 300mm version of its wildly successful RFeSI line (see press release here). What’s it all about? FEMs. RF front-end module – aka FEM – chips handle the back-and-forth of signals between the transceiver and the antenna. FEMs built on […]