ASN Celebrates a Decade of SOI News, Views and Commentary

April 2015 marks the 10-year anniversary of the first ever issue of Advanced Substrate News, aka ASN, covering news and views from the SOI ecosystem. Wow, were we precient. Consider some of the topics we covered in that first edition, back in April of 2005: the Oki FD-SOI chip in the Casio G-Shock watch FinFET […]

Huge Success of Semicon China: Opportunities in a Fast-Changing Landscape

Semicon China (Shanghai, 17-21 March 2015) was an awe-inspiring event.   The sheer size and the energy were dazzling. But it was the investment plans prompted by the government’s injection of RMB 120 billion (US$19.6 billion) last fall in seed money for the industry with supporting local funds pouring in that was clearly the source of […]

SOI for MEMS, NEMS, sensors and more at IEDM ’14 (Part 3 of 3 in ASN’s IEDM coverage)

Important SOI-based developments in MEMS, NEMS (like MEMS but N for nano), sensors and energy harvesting shared the spotlight with advanced CMOS and future devices at IEDM 2014 (15-17 December in San Francisco). IEDM is the world’s showcase for the most important applied research breakthroughs in transistors and electronics technology. Here in Part 3, we’ll […]

Tronics Manufactures the First Piezoresistive Nanowire 6DOF Inertial MEMS (SOI)

       A year after announcing the industrialization of CEA-Leti’s breakthrough M&NEMS technologies, Tronics has successfully designed and manufactured the first batch of six-degrees-of-freedom (6DOF) MEMS chips, with 3 accelerometers and 3 gyroscopes on a single die (press release here). Built on SOI wafers, with a die size of less than 4mm2, this 6DOF MEMS […]

IP Value Starts at the Substrate Level

If you say “IP” in the chip business, everyone thinks of cores and design. But in fact, the importance of intellectual property for chips can extend right down to the substrate level. Engineered, advanced wafer substrates open new doors for designers. For example, Soitec recently announcement that we are licensing some of our Smart Stacking™ […]

Soitec has licensed some of its intellectual property portfolio related to back-side illumination technology for image sensors to TSMC

Soitec, a world leader in generating and manufacturing revolutionary semiconductor materials for the electronics and energy industries, has licensed some of its intellectual property (IP) portfolio related to back-side illumination (BSI) technology for image sensors to TSMC. BSI is a key enabling technology in the race to develop small-pixel, high-quality image sensors used in consumer […]

SOI – 3D Integration – Subthreshold Microelectronics: Register now for the IEEE S3S!

Last May, we already let you know about the IEEE S3S conference, founded upon the co-location of The IEEE International SOI Conference and the IEEE Subthreshold Microelectronics Conference, completed by an additional track on 3D Integration. Today, we would like let you know that the advance program is available, and to attract your attention on […]