Don’t miss EuroSOI-ULIS, 25-27 January 2016 in Vienna. Call for papers still open.

The 2016 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon, aka EUROSOI-ULIS 2016 will be taking place January 25-27, 2016 in Vienna, Austria. The event will be hosted by the Institute for Microelectronics, TU Wien. The focus of the sessions is on SOI technology and advanced nanoscale devices. The organizing committee […]

GF’s 22nm FD-SOI Offering – Where to Get Lots of Excellent Info

A fast-growing body of information is now posted by GlobalFoundries on their new 22nm FD-SOI offering. After years of asking “where’s FD-SOI on the GF website??”, it’s (finally!) there, front and center. There are some excellent new videos and documents. Here’s a rundown of what you’ll find. When you click down the “Technology Solutions” tab […]

Industry 1st: Leti Demos MEMS on 300mm Wafers – And Yes, They’re SOI

In what may be a first for the MEMS industry, CEA-Leti has manufactured micro-accelerometers on 300mm wafers, a development that could lead to significantly lower MEMS manufacturing costs. And yes, those 300mm wafers are SOI wafers. These are “thick” SOI wafers, with an insulating BOx (buried oxide) layer of 2µm, and top silicon of 220nm. […]

Soitec board names CEO Boudre Chairman; Auberton-Hervé Chairman Emeritus

Soitec, the world’s SOI wafer leader, announced that the Board of Directors has named André-Jacques Auberton-Hervé as Chairman Emeritus (he founded Soitec together with Jean-Michel Lamure in 1992). CEO Paul Boudre has been appointed Chairman of Soitec’s Board of Directors. (Read the press release here.)

IBM 0.3V SOI-FinFET SRAM paper garners press attention

An IBM paper on a 14nm SOI-FinFET SRAM functional down to 0.3V has garnered press attention. The paper, entitled 14nm FinFET Based Supply Voltage Boosting Techniques for Extreme Low Vmin Operation by R.V. Joshi et al, was presented during the Symposium on VLSI Circuits in Kyoto, Japan in June. According to the abstract, the authors […]