Foundries Expand Rapidly to Meet Soaring RF-SOI Demand (SemiEngineering)

“GlobalFoundries, TowerJazz, TSMC and UMC are expanding or bringing up RF SOI processes in 300mm fabs in an apparent race to garner the first wave of RF business for 5G, the next-generation wireless standard,” writes Mark Lapedus of Semiconductor Engineering. His recent piece, RF-SOI Wars Begin, explains why demand across the supply chain is currently […]

SOI for MEMS, NEMS, sensors and more at IEDM ’14 (Part 3 of 3 in ASN’s IEDM coverage)

Important SOI-based developments in MEMS, NEMS (like MEMS but N for nano), sensors and energy harvesting shared the spotlight with advanced CMOS and future devices at IEDM 2014 (15-17 December in San Francisco). IEDM is the world’s showcase for the most important applied research breakthroughs in transistors and electronics technology. Here in Part 3, we’ll […]

Strong uptick in FD-SOI patent activity, according to KnowMade report

There’s been a significant uptick in patents related to fully-depleted SOI, according to a new report by KnowMade (click here to get the report brochure).  The report looks at both FD-SOI and SOI-FinFETs (both of which are fully depleted technologies).  More than 740 patent families have been published to date, of which planar FD-SOI accounts for 340 families.  Following a […]

Semiwiki Reveals TSMC’s FD-SOI Patent Activity

Revelations by semiwiki’s Eric Esteve that TSMC has filed a significant FD-SOI patent has generated a rush of speculation in the press and online forums.  In his piece When TSMC advocates FD-SOI…,  Esteve noted that TSMC’s patent for “Planar compatible FDSOI Design Architecture” (granted 14 May 2013) heralded the advantages as follows: “Devices formed on […]

New SOI Textbook (and e-book) with contributions by experts at Soitec, GF, TSMC, Leti and more

A new book entitled Silicon-On-Insulator (SOI) Technology, Manufacture and Applications (1st Edition) features contributions by experts at Soitec, GF, TSMC, Leti and more. Billed as “a complete review of this rapidly growing high-speed, low-power semiconductor technology,” the book covers the entire SOI spectrum, from Moore to More than Moore.  It goes into SOI wafer technology,  […]

At 14nm FD-SOI’s 30-40% Cheaper than Intel’s Technology, Says GSS CEO

“At 14nm FD-SOI is much cheaper, 30-40% cheaper, than Intel’s technology,” Asen Asenov told David Manners in a recent Electronics Weekly post (see full post here).  Asenov is CEO and Founder of Gold Standard Simulations (GSS).  The subject of the post was how TSMC has turned to GSS for statistical analysis tools. Professor Asenov is […]

IP Value Starts at the Substrate Level

If you say “IP” in the chip business, everyone thinks of cores and design. But in fact, the importance of intellectual property for chips can extend right down to the substrate level. Engineered, advanced wafer substrates open new doors for designers. For example, Soitec recently announcement that we are licensing some of our Smart Stacking™ […]

Soitec has licensed some of its intellectual property portfolio related to back-side illumination technology for image sensors to TSMC

Soitec, a world leader in generating and manufacturing revolutionary semiconductor materials for the electronics and energy industries, has licensed some of its intellectual property (IP) portfolio related to back-side illumination (BSI) technology for image sensors to TSMC. BSI is a key enabling technology in the race to develop small-pixel, high-quality image sensors used in consumer […]