Leti’s M3D, now dubbed “CoolCube”, featured in EETimes

Leti’s monolithic 3D technology, which has now been dubbed “CoolCube”, was featured in a recent EETimes piece.  Entitled True 3D monolithic integration eliminates TSV dependence (click here to read it), the article covers a Leti paper presented during a 3D-VLSI workshop preceding IEDM ’14.  Leti’s Advanced CMOS lab manager Maud Vinet detailed the “cool” process in […]

U. Washington Selects Altatech (Soitec) CVD System to Develop New Process Materials

The University of Washington’s Nanofabrication Facility (WNF) is the first North American institution to get an AltaCVD™ chemical vapor deposition (CVD) system (press release here). The AltaCVD system uses pulsed deposition technology to offer a unique combination of capabilities for developing new materials. It can perform atomic layer deposition (ALD) for exceptional 3D coverage at deposition rates […]

SOI for MEMS: A Promising Material

A new Yole report highlights growth of SOI MEM S. Although MEMS technologies are not driven by CD shrinking as ICs, that does not mean MEMS do not undergo strong technological evolutions. The ever-growing MEMS markets, today mostly driven by consumer applications, now have to be performance-driven, cost-driven and size driven. SOI wafers are a […]

SOI at IEDM 2010

The 2010 IEEE International Electron Devices Meeting (IEDM) was held December 6-8, 2010 in San Francisco. The IEDM continues to be the world’s premier venue for presenting the latest breakthroughs and the broadest and best technical information in electronic device technologies. Here are summaries of key papers referencing work on SOI or other advanced substrates. […]