GF, NXP, Infineon and more at SOI Workshop During Silicon Saxony Day (Dresden, 7 July 2015)

Silicon Europe (an alliance of Europe’s leading micro- and nanoelectronics clusters) and the SOI Consortium have organized an SOI Workshop on the 7th of July 2015, during the 10th Silicon Saxony Day in Dresden. Here’s the agenda: Quick Introduction More than Moore Market Analysis and Opportunities (Yole) Power SOI and applications (NXP) Foundry offer (GlobalFoundries) […]

Shanghai More-Than-Moore Presentations Now Posted on SOI Consortium Website

Presentations given at the ‘Beyond Computing’ Innovative Technologies Symposium (March 2015 in Shanghai) are now available on the SOI Consortium website (click here to see the list). The Symposium covered MEMS, semiconductor manufacturing, RF and power, which are key topics for the fast growing “More than Moore” industry. The one-day, closed-door symposium was organized by […]

SOI: Looking Back Over a Year of Moving Forward (Part 2, RF-SOI & SOI-FinFETs)

As we noted in the previous post (click here if you missed it), 2014 should be a terrific year for the greater SOI community. But before we look forward (which we’ll do in an upcoming post), let’s continue considering where we’ve been and some of the highlights of the last year.  In fact, there was […]

Toshiba Says New RF-SOI Antenna Switch for Smartphones Is Smallest

Another RF-SOI solution is making headlines. Leveraging SOI, Toshiba has announced an SP10T RF antenna switch for the smartphone market. The company says it achieves the industry’s lowest insertion loss and smallest size. The company credits its new generation TaRF5 process, the latest in its line of Toshiba-original TarfSOI™ (Toshiba advanced RF SOI) processes. The […]

SiTime, which leverages SOI for high-performance MEMS timing solutions, has introduced TempFlat™ MEMS

SiTime, which leverages SOI for high-performance MEMS timing solutions, has introduced TempFlat™ MEMS. Until recently, all MEMS oscillators used compensation circuitry to stabilize the output frequency over temperature. SiTime’s TempFlat MEMS is a revolutionary breakthrough that eliminates temperature compensation, resulting in dramatically higher performance, smaller size, lower power and cost, says the company. According to […]

More than 65 percent of substrates used in fabricating switches for handsets are SOI based, according to the industry research firm Yole Développement

More than 65 percent of substrates used in fabricating switches for handsets are SOI based, according to the industry research firm Yole Développement. This shows the massive adoption of RF SOI for this booming electronic market experiencing double-digit growth.  Soitec, the world’s leading manufacturer of SOI wafers, says that this shows that SOI-based technologies are […]

MEMS on SOI – Growing Fast and Faster

In the latest ASN posting by Dr. Eric Mounier of Yole Developpement, “SOI for MEMS: A Promising Material”, he notes that SOI MEMS is growing at a CAGR (2011-2015) of 15.6%, compared to 8.1% for bulk silicon-based solutions. MEMS designers are doing amazing things on SOI – which would explain that impressive growth rate. The […]

SOI for MEMS: A Promising Material

A new Yole report highlights growth of SOI MEM S. Although MEMS technologies are not driven by CD shrinking as ICs, that does not mean MEMS do not undergo strong technological evolutions. The ever-growing MEMS markets, today mostly driven by consumer applications, now have to be performance-driven, cost-driven and size driven. SOI wafers are a […]

A Good Time for Innovation

Yole looks for a wide range of MEMS-based products to be introduced this year. Despite the current economic situation, a piece of good news is that innovation will not come to a halt in 2009: we expect that this will be one of the greatest years ever for new product introductions. The MEMS market in […]