The IEEE S3S (SOI/3D/SubVt) has issued its call for papers for the 2016 conference (click here for details). The theme of the conference, which will take place October 10th – 13th in San Francisco, is “Energy Efficient Technology for the Internet of Things”. This industry-wide event gathers together widely known experts, contributed papers and invited talks focused on SOI Technology, Low-Voltage Devices/Circuits/Architectures, and 3D Integration. In addition to over 100 contributed and invited papers, the conference will feature prestigious Keynotes and a Hot Topics session.
For the first time, the Conference will include two Tutorials free-of-charge with Conference registration: one on FD-SOI Circuit Design and another on Technologies for Monolithic 3D Integration. A full-day short course addresses Energy Efficient Computing and Communications including RF circuit technology.
The paper submission deadline is the 15th of April 2016. As always, there will be a Best Paper Award and a Best Student Paper Award. But for the first time, the Best Student Paper Award includes a $1,000 prize from one of the conference’s industry sponsors.
The papers presented here give industry an excellent window on what’s coming next. For example, work demonstrating a viable integration path for stacked nanowires that was first presented in a Leti paper at the 2015 S3S Conference was awarded the Paul Rappaport IEEE Prize two months later at IEDM 2015.
S3S is a great conference – don’t miss it.