SOI technology is at the base of cellular wireless connectivity: 4G and 5G are driving up the demand for both 300mm and 200mm capacity, both in short supply. The 4G expansion and the introduction of 5G are also enlarging the scope to new applications and new frequency ranges, up to supporting mm-wave. The demand is not only about supporting continuously growing volumes, but requires to develop solutions using differentiated silicon technologies (RF-SOI, PD-SOI, FD-SOI) and to offer integrated system solutions (in-package modules, including integrated antennas).
The workshop has develop such requirements and the current solutions available from a supply chain perspective, involving substrate suppliers, equipment and material suppliers (for both substrate/silicon manufacturing and packaging solutions), and foundries.
Enabling the Engineered SOI Wafer, Sesh Ramaswami, Managing Director, Applied Materials (presentation not available)
Synergies with the SOI Industry, Olivier Vatel, Corporate Director, Senior Vice President and CTO of SCREEN Semiconductor Solutions, Screen (presentation not available)
Ultra-thin Double Layer Metrology with High Lateral Resolution, Bernd Srocka, Vice President, Unity GmbH
Inspection and Metrology Relevance in SOI Manufacturing, Jijen Vazhaeparambil, Vice President & General Manager, KLA-Tencor