During the one and a half day workshop, leading companies working in the domain of SOI based technologies were meeting together in Tokyo to discuss about SOI Ecosystem and “Convergence of IoT, Automotive through Connectivity”.
TCAD, EDA and IP to Support FDSOI – David Dutton, CEO Silvaco (presentation not public)
FDX™ Goes Mainstream – Gregg Bartlett, SVP GlobalFoundries
INVECAS IP Portfolio in 22FDX – Bhaskar Kolla, Sr.Director Business Development and Customer Engineering, Invecas
FDSOI : A Low Power, High Performance Technology Scalable Down to 10nm – Laurent Grenouillet, Expert, CMOS & Memory Integration, CEA-Leti
I-Fuse(tm): The Best OTP of Choice for FD-SOI and Sub-14nm Nodes – Shine Chung, Chairman, Attopsemi Technology
Product Design Methodology – Christophe Tretz, SOI Consortium
Ultra Low Power Applications
Sony Semiconductor Solutions , Low Power IoT Solution – Kenichi Nakano, General Manager, Sony IoT (presentation not public)
Technologies for Automotive
LIDARs and Sensor Fusion ECUs Advancing ADAS Architectures towards Automated Driving – Akhilesh Kona, Senior Analyst, IHS Markit
MIPS Leading Heterogeneous Compute in Automotive & IoT – Steven Yeung, Design Manager, MIPS, Imagination Technologies
Future of Automotive Industry – Road is Paved with SOI – Vincent Roger, Corporate Business Developer, CEA-Leti
IoT – Connectivity – Infrastructure
Enabling An Interconnected Digital World – Jonathan Smith, Director, Cadence
Nokia Future X Network for 5G and IoT –Brian Cho, Head of Technology for APAC & Japan, Nokia on infrastructure for 4G/5G
Delivering on the Promises of 5G: Semiconductor Solutions for the Next Wave of Data – Peter Rabbeni, Senior Director, GlobalFoundries
Sensor-to-Cloud Connectivity Solution for IoT – Hiroshi Noguchi, Director of AMG Product Marketing, STMicroelectronics
Supply Chain
Enabling SOI and IoT: An Equipment and Materials Engineering Perspective – Sesh Ramaswami, Managing Director, Applied Materials (presentation not public)
SCREEN Equipment Manufacturer: Full participation within the SOI Consortium – Hirofumi Uchida, Senior VP, Screen
Role of Substrate in Accelerating Mass Adoption of SOI Technologies –Thomas Piliszczuk, EVP, Soitec (presentation not public)
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