World 1st and It’s on 28nm FD-SOI: ST Sampling ePCM (eNVM) for Automotive MCUs

STMicroelectronics is now sampling 28nm FD-SOI microcontrollers (MCUs) with embedded non-volatile memory (eNVM) based on ePCM to alpha customers. Field trials meeting the requirements of automotive applications and full technology qualification are expected in 2020. These MCUs—the world’s first to use ePCM, which stands for embedded Phase-Change Memory—will target powertrain systems, advanced and secure gateways, […]

2019 Greetings for the Start of an Exciting Year in SOI

Welcome to our first post for 2019 here at the SOI Consortium’s Advanced Substrate News. First and foremost, may we wish you and yours a safe, happy, healthy and prosperous year. It should be a good year across the SOI ecosystem, with new products, players, IP, technologies and tools — and high volumes. What’s new? […]

EuroSOI-ULIS (April 2019, Grenoble) – 1st Call for Papers

The organizing committee of the EuroSOI-ULIS conference, which will be held in Grenoble on the 1st-3rd of April 2019, has issued a first call for papers. The deadline is 15 January 2019. Here are the submission guidelines, and here is a poster you can share with colleagues. If you’ve never been, you should put it […]

Now, We Ramp! Panelists at Japan Workshop See Good Opps for FD-SOI, RF-SOI

Lots of great information came out of the two days of workshops in Japan recently organized by the SOI Consortium. Some of the presentations are now posted on the consortium website (get them here). The first day (held in Yokohama and sponsored by Silvaco) focused on FD-SOI and RF-SOI design. The second day (held at […]

New Bluetooth 5 RF IP from VeriSilicon Targets Wearables, IoT on GF’s 22FDX

Since about a third of all IoT devices are expected to be connected by Bluetooth, chip designers need IP solutions that will help reduce system cost and greatly improve battery life. And that’s just what VeriSilicon has announced for GlobalFoundries’ 22FDX® (FD-SOI) process. “By taking advantage of integrated RF capabilities of FD-SOI, in particular GF’s […]

QuickLogic ultra-low power eFPGA on GF’s 22FDX FD-SOI and in PULP/RISC-V SoC

Some great pieces of FD-SOI news from QuickLogic. The company recently demonstrated its ultra-low power ArcticPro™ embedded FPGA (eFPGA) solutions at the GlobalFoundries Technology Conferences in Santa Clara, California, Munich and Shanghai. The technology is available now. ArcticPro is the industry’s first eFPGA offering for GF’s 22FDX® process (btw they’ve been shipping it in volume […]

4G/5G Opps for SOI Supply Chain – Workshop Presentations Now Posted

The presentations from the SOI Consortium sponsored workshop held during Semicon West are now posted and freely available on the website – click here to see the full agenda with links to the presentations. The workshop, entitled 4G/5G Connectivity: Opportunities for the SOI Supply Chain, was well-attended and generated excellent discussions. If you don’t have […]

Chengdu Conference Indicates FD-SOI Will Play Major Role in China/Automotive

FD-SOI was a very important topic during the recent Mount Qingcheng China IC Ecosystem Forum. To situate things, Mount Qingcheng, with its lush hills and waterways, is located just outside of Chengdu. That of course is where GlobalFoundries is building its new fab, which will be the first in China to run FD-SOI. Chengdu is […]