Tag Archive SITRI

ByAdele Hars

SOI Consortium & Ecosystem Shines at SOI Academy (Shanghai) & WCS (Nanjing)

The SOI Consortium and member companies had a significant presence at two important events in China recently: the World Semiconductor Congress (WCS) in Nanjing and the SOI Academy, including an FD-SOI Training Day in Shanghai.

Nanjing is especially known as a leading RF chip design hub in China, but WCS went well beyond RF. The three-day 2019 event was held at the Nanjing International Expo Center. It attracted over 30,000 visitors, 5000 of whom attended the various summit forums.

Presenting at WCS ’19 in Nanjing (clockwise from top left): Wayne Dai, CEO/Founder, VeriSilicon; Carlos Mazure, Executive Director, SOI Consortium; Giorgio Cesana, Director, STMicroelectronics; Christophe Tretz, Design Expert, SOI Consortium.
(Photos courtesy: WCS)

The SOI Consortium organized the SOI Forum, which was part of an afternoon Innovation Summit. Presentations were given by members of the SOI Consortium team, and by leaders from our membership, including Simgui, NXP, Incize, ST, IBM, Cadence and Xpeedic. Some of those presentations are now available from our website — click here to get them.

Earlier in the day, SOI Consortium member VeriSilicon participated in a morning session on AI and IoT Wireless Communications. They presented their low-power Bluetooth design platform for GlobalFoundries 22FDX, and CEO Wayne Dai moderated a lively round-table discussion.

Following hard on the heels of the Nanjing event, the SOI Consortium team and members headed to Shanghai for the SOI Academy 2019, hosted for the second year in a row by member SIMIT (Shanghai Institute of Microsystem and IT under the Chinese Academy of Sciences). The two-day event attracted more than 250 professionals from more than 100 domestic and foreign IC companies and research institutes.

Keynotes by SOI Consortium Executive Director Carlos Mazure, SITRI CEO Mark Ding and Jean-Eric Michallet, Head of the Microelectronics Components Department at Leti and bizdev director for the SOI Consortium focused on the SOI ecosystem. The SITRI and Leti talks also gave updates on their research and industrialization alliance. Further talks were given by leaders from Soitec, GlobalFoundries, VeriSilicon, IBM and Xpeedic. These addressed the growing FD-SOI ecosystem, applications in automotive electronics, 22 nm and 10 nm FD-SOI devices, advanced SOI substrate technology, China’s FD-SOI development, the FD-SOI manufacturing process, product design, EDA tools and all aspects of industry’s software and modeling value chain.

Several speakers noted that more and more local Chinese customers are actively adopting FD-SOI for low-power, high-performance chips.

SOI Academy, Shanghai, 2019, FD-SOI Training Day attendees.
(Photo credit: SIMIT)

The second day was devoted to hands-on professional training, given by experts from Leti using an actual PDK and punctuated by in-depth discussions. This helped the IC designers to fully understand the advantages and flexibility of FD-SOI in low-power logic, analog/mixed-signal and RF.

All in all, “It was a great success,” concluded Jean-Eric MICHALLET, Head of the Microelectronics Components Department at Leti and bizdev director for the SOI Consortium. Plans for the next SOI Academy are already underway, with plans to extend the topics to include more on photonics, RF, power and MEMS.

ByAdele Hars

FD-SOI Training: Over 220 Attend 1st SOI Academy in Shanghai

There were over 220 participants at the recent SOI Academy FD-SOI Training event organized in Shanghai. The event extended over two days, with the first day covering a basic introduction to the technology as well as the ecosystem worldwide and in China. The second day was hands-on professional training. Attendees got a comprehensive understanding of how to leverage the benefits and flexibility of FD-SOI design techniques for low-power chips including logic, mixed-signal/RF and analog blocks.

They had a great line-up of experts from whom to learn – check out the agenda here. There was also a follow-up press release (in Chinese) from SITRI here. There will be more of these SOI Academy events in cities across China in the year to come – we’ll keep you posted (and of course, keep checking back for news on the Consortium’s Events page).

SOI Academy ’18 keynotes by: Dr. Mark Ding, CEO, SITRI; Dr. Carlos Mazure, EVP Soitec and Chairman/Executive Director SOI Consortium. Dr. Julien Arcamone, EVP Leti. (Images courtesy: SITRI). Lower right: the hands-on FD-SOI training.

The two-day seminar and hands-on FD-SOI design training was (superbly!) co-organized by SITRI and Leti, with the support of the SOI Industry Consortium at the Jiading SIMIT campus outside of Shanghai.

Just to put this in perspective, SIMIT and SITRI are absolutely key players in China’s chip ecosystem. SIMIT is the Shanghai Institute of Microsystem and Information Technology, one of the most venerable institutes in the Chinese Academy of Science (CAS) and one of the world’s earliest pioneers in SOI. SITRI is the Shanghai Industrial μTechnology Research Institute, an international innovation center focused on globally accelerating innovation and commercialization of More-than-Moore for IoT. Both institutions are under the aegis of Dr. Xi Wang, Chairman of SITRI, Director General of SIMIT, Academician of CAS, and champion of all things SOI in China.

At this Shanghai event, the participants came from industry (including big companies, SMEs and startups) and technical institutions. In fact as well as attendees from Shanghai people voyaged from other cities such as Shenzhen and Chengdu.

The designers participating to the FD-SOI training day were all experienced in design and highly motivated in learning FD-SOI design, notes Carlos Mazure, Chairman & Executive Director of the SOI Industry Consortium, and Executive VP of Soitec. “This made it possible to dive into the specificities of FD-SOI,” he said, adding that, “The focus on RF was very timely.”

Day 1: Intro to FD-SOI

The first afternoon opening keynotes were made by SITRI CEO Dr. Mark Ding and Leti EVP Dr. Julien Arcamone. These were followed by overview talks by execs from Soitec, Verisilicon and GlobalFoundries.

After a lively networking break, three talks delved into FD-SOI technology. The first was by Professor Sorin Cristoloveanu, Laureate of the IEEE Andrew Grove Award and Director at the CNRS (the French National Center for Scientific Research – the largest governmental research organization in France and the largest fundamental science agency in Europe). He covered device physics and characterization techniques. This was followed by talks on the technology by Soitec Fellow Bich-Yen Nguygen, and by Dr. Christophe Tretz, IBM Sr. Engineer on product design methodology.

The day ended with a dinner, where Professor Cristoloveanu says enthusiastic technical discussions continued unabated (and continued even further in follow-up emails), lots of business cards were exchanged, and opportunities for further education were explored.

Day 2: Hands-on Training

The second day, designers got hands-on training from Leti experts using FD-SOI PDKs, first in the morning on digital, then in the afternoon on RF. Everyone loved the lively discussion and in-depth exchanges between the experts and the designers. They agreed that FD-SOI has important applications and differentiated competitive advantages for IoT, 5G, automotive, AI and other fields. At the end of the training, Leti and SITRI jointly issued SOI Academy certificates of completion to the designers.

Feedback from participants was very good. Some asked for further education and for hands-on testimonials from companies that are already designing and manufacturing products on FD-SOI.

“The participants were focused, motivated, involved, with good knowledge, which helped make the three hours of Digital training effective,” said Dr. Alexandre Valentian, Leti Sr. Expert, Digital Design. “The IT team was very helpful in setting up the training, the students accounts and the hardware infrastructure.”

“The training on Basics of FD-SOI RF circuit was a great success thanks to the efficiency of our Chinese partners and also thanks to the enthusiasm and the good level of our trainees. As senior Expert of CEA Leti I was really impressed by the professionalism of the organization team. For all these reasons, I’m very glad to have had the opportunity to contribute to the 2018 SOI Academy,” said Dr. Baudouin Martineau, Leti Sr. Expert, RFIC Design & Technologies.

“The professionalism, efficiency and enthusiasm of our Chinese partners and the level and technical relevance of all trainees made the training on Basics of FD-SOI RF circuit a great success and fruitful experience,” added Frédéric Hameau, Sr. RF Research Engineer, Leti Project Leader, Architecture, IC Design & Embedded Software Division, RF Architectures and ICs Laboratory. “It was a pleasure to get the opportunity to be part of this first edition of SOI academy 2018.”

The organizers would like to thank the sponsors, including: the SOI Consortium and its members Soitec, VeriSilicon, GlobalFoundries, Simgui and Cadence, as well as Mentor, ProPlus and other companies and institutions in China and worldwide. Dr. Mazure notes that special recognition must go to Dr. Julien Arcamone, EVP, Leti-CEA and to Qing Wang-Bousquet, SITRI representative, for the perfect and smooth organization, and to the Leti instructors, who are international experts and highly committed.

“As one of the main initiators and organizers of the 2018 SOI Academy, I wanted to personally thank all of you for your respective contribution to this first edition of the SOI Academy,” concludes Dr. Arcamone. “Undoubtedly, it was a great success, very well organized and fluid and we can be proud of that.”

ByAdele Hars

Where to Sign Up for FD-SOI and RF-SOI Learning Opps in China?

Suddenly they’re everywhere: opportunities to learn more about FD-SOI and RF-SOI. Over the next couple of months you can find them in China, Europe and Silicon Valley. Some are organized by the SOI Consortium, others by foundries and partners.

Here’s a quick listing with links for more info on how to register for upcoming China events.

Nanjing, China. SOI Workshop & Tutorial, 21-22 September 2017.

Organized by the Nanjiing city government and the SOI Consortium. The first day is packed with top presenters, including NXP, ST, Samsung, GlobalFoundries, Cadence, Synopsys, as well as design and IP partners. The second day is a tutorial covering FD and RF-SOI, as well as imagers and photonics. Sessions will be given by Synopsys, Silvaco, Incize, ST, Soitec, and the SOI Consortium.

Shanghai, China. FD-SOI Tutorial. 25 September 2017.

Organized by VeriSilicon and the SOI Consortium. Tutorial covers: tech overview; analog/RF/mixed-signal; neuromorphic and IoT processors; EDA & design process flow; eNVM; and using forward & reverse body bias. Session leaders are from SOI Consortium, GlobalFoundries, ST, Soitec, UCBerkley, Evaderis and Greenwaves.

Shanghai, China. FD-SOI Forum. 26 September 2017.

Organized by VeriSilicon, Simgui, SIMIT and the SOI Consortium. The focus is on Ultra Low Power computing, RF, EDA/IP ecosystem growth and accelerating adoption. Presentations by Dr. Xi Wang of China’s SIMIT/CAS, GF’s CEO Dr. Sanjay Jha, Samsung’s EVP & GM Dr. ES Jung, as well as from Ron Martino, VP & GM from NXP; Paul Boudre, CEO of Soitec; IBS, NSIG, GF, UC Berkeley, VeriSilicon, Cadence and Synopsys. There’s also a very impressive line-up for a final panel discussion.

Shanghai, China. International RF-SOI Workshop. 27 September 2017.

Organized by Simgui, Sitri, SIMIT, VeriSilicon and the SOI Consortium. Now in its 5th year, this conference has grown very quickly: last year it was in a ballrooom with standing room only (note that RF-SOI chips are now found in pretty much every smart phone on the planet). The focus this year is on IoT, mobile, 5G connectivity, and mmW. Keynotes are from TowerJazz, Sony and China Mobile. Presentations from RDA, SMIC, Simgui, Will-Micro, GF, Soitec, Silvaco and Screen.

BTW, for events organized by the SOI Consortium, many of the presentations are available on the website (from Tokyo this summer, for example, and Silicon Valley last spring – and going on back through 2015). Scroll down through Events to Past Events to find them.

ByGianni PRATA

Shanghai & Grenoble tech dev powerhouses team up on SOI for IoT in China and global innovation ecosystem

LetiLogo MinatecLogo SITRI-LOGO-EN-2Three of the world’s More-than-Moore and SOI technology development powerhouses have signed a comprehensive agreement for ongoing collaboration and cooperation in developing new technologies for the emerging IoT market. SITRI of Shanghai, and CEA-Leti and Minatec of Grenoble will work together to accelerate the adoption of their latest technologies and create a global innovation ecosystem for emerging IoT applications (read the press release here).

The framework agreement broadly covers all joint areas of research at SITRI and Leti, including MEMS and sensors, 5G RF front ends, ultra-low power computing and communication, RF-SOI and FD-SOI.

In fact, the trio cites SOI as a key technology in the development of both Moore’s Law and “More than Moore” solutions for the IC industry, as it brings cost, performance, power and integration advantages to the areas of ICs, RF, MEMS, and communications.

“We are confident that this collaboration will be positive for China’s electronics industry, as well as for the Grenoble region’s growing SOI technology ecosystem,” said MINATEC Director Jean-Charles Guibert.

Adds Marie-Noëlle Semeria, CEO of Leti, “Through this partnership, SITRI, MINATEC, CEA-Leti and the entire ecosystem will be able to promote and extend this ecosystem to SOI partners worldwide, and provide SOI solutions to the emerging Chinese IoT market.”

“MINATEC is a world-class international innovation center that fosters a wide range of leading-edge IoT technology research and development which is home to CEA-Leti, the renowned international research institute in microelectronics,” said Charles Yang, President of SITRI. “Through this agreement and SITRI’s established platform for ‘More than Moore’ commercialization, we can accelerate the adoption of these latest technologies and create a global innovation ecosystem for emerging IoT applications.”

ByGianni PRATA

Shanghai FD-SOI and RF-SOI Presentations From Top CEO/CTO/VPs on SOI Consortium Website

A very successful two-day forum on FD-SOI and RF-SOI in Shanghai (September 2015) featured presentations from CEOs, CTOs and VPs at GF, ST, Leti, ARM, Verisilicon, Synapse Design, SITRI, Skyworks, Freescale, TowerJazz, Soitec, Qorvo and many more. Most of the presentations are now available on the SOI Consortium Website, and the rest are expected shortly, so keep checking back.

To download the “Design for FD-SOI” presentations, see the list here.

To download the “RF-SOI Workshop – Interconnected World” presentations, see the list here. (Presentations from all of the major SOI wafer suppliers are also available on this page.)

ByGianni PRATA

Soitec and SITRI team up on RF-SOI, LTE-A/5G for China and more

SoitecSITRISOI wafer leader Soitec and SITRI (aka Shanghai Industrial µTechnology Research Institute) have announced a collaboration agreement. (Read the press release here.) They say the strategic partnership will strengthen their leadership in high-growth wireless communications and the global market for RF apps, with a special emphasis on the fast-developing Chinese RF ecosystem.

They’ll focus on developing RF-SOI using advanced circuit designs based on Soitec’s substrate materials and technologies.

“Experience shows that Soitec’s engineered substrates can optimize RF-SOI technology and applications in terms of both cost competitiveness and power efficiency. This strategic partnership will enable us to push the limits of RF circuits and meet future connectivity needs,” said Soitec CTO Carlos Mazure.

“Enhancing RF signal integrity is a key focus of the mobile communications industry as it builds toward 4G-LTE Advanced and 5G standards. We are excited to partner with Soitec in developing next-generation SOI communication solutions. It is consistent with SITRI’s mission to create a collaborative R&D and commercialization environment to catalyze the growth of advanced technologies,” said Dr. Charles Yang, president of SITRI.

By

Successful RF-SOI 2014 International Symposium Held in Shanghai

A very successful international workshop on RF-SOI was held in Shanghai earlier this fall.  Jointly organized by industry leaders, it brought together world-class players in RF to discuss the opportunities and challenges in rapid development of RF applications.Sponsors included the SOI Industry Consortium, the Chinese Academy of Sciences (CAS) / Shanghai Institute of Microsystem and Information Technology (SIMIT), Shanghai Industrial μTechnology Research Institute Co.,Ltd. (SITRI) and VeriSilicon.

The first talk, given by Dr. Xi Wang, Academician of CAS and Director General of SIMIT, covered China’s huge market prospects for RF applications. RF-SOI, he noted, is an area in which Shanghai Simgui Technology Co.,Ltd. ,  a spin-off company from SIMIT,  and French SOI wafer manufacturer Soitec are working closely to explore the market opportunities now. He also presented some of the latest research findings and the industry dynamics in this field.

Xi Wang, Academician and Director General of the Shanghai Institute of Microsystem and Information Technology (SIMIT) /Chinese Academy of Sciences (CAS) giving the first talk at the 2014 International RF-SOI Workshop.

Xi Wang, Academician and Director General of the Shanghai Institute of Microsystem and Information Technology (SIMIT) /Chinese Academy of Sciences (CAS) giving the first talk at the 2014 International RF-SOI Workshop.

 

Next, Handel Jones, CEO of IBS, gave a detailed analysis of the markets for smart phones and tablet PCs and other mobile consumer applications. These are strong drivers of the huge market opportunity and demand for chips based on RF-SOI technology. (Click here to view his presentation.)

 

(Courtesy: IBS)

(Courtesy: IBS)

This workshop also featured presentations by ST, GlobalFoundries and SMIC, as well as several important RF-SOI platform providers.

Mark Ireland, Vice President of Strategy and Business Development at the IBM Microelectronics Division, noted that that IBM first began offering RF-SOI manufacturing in 2006.  He explained the key role RF-SOI plays in redefining chips for mobile applications, where integration and performance are key. (Click here to view his presentation.)

Laura Formenti, Infrastructure and RF-SOI Business Unit Director at STMicroelectronics, gave a detailed analysis of RF-SOI. She covered the advantages of RF front-end integration and introduced ST’s H9SOI_FEM technology platform. (Click here to view her presentation.)

Paul Colestock, Sr. Director of Segment Marketing at GlobalFoundries shared specifics and the latest developments in the 130nm RF-SOI technology platform, UltraCMOS 10.

 

The room was full at the Shanghai RF-SOI Workshop 2014

The room was full at the Shanghai RF-SOI Workshop 2014

 

Herb Huang, Sr. Director Development, Technology R&D at SMIC, China’s largest foundry, addressed SOI in RF switches. He shared details on SOI NFETs for enhanced performance, and on CMOS MEMS RF filters. SOI CMOS will facilitate integration of switches (SW), power amplifiers (PA), envelope tracking (ET) and antenna tuning (AT) in SoCs. The foundry provides not only device-level processes but also support for high-performance system-in-package (SiP) solutions at the wafer level.

Professor Jean-Pierre Raskin of the Catholic University of Leuven (Belgium) and Bernard Aspar, General Manager of Soitec’s Communication & Power Business Unit presented detailed technical analyses of SOI substrates.  They covered the influence of substrates on RF signal integrity and the key role they play in improving RF performance thanks to the enhanced Signal Integrity (eSI™) High Resistivity SOI substrate.  (Click here to view the UCL presentation, and here to view the Soitec presentation.)

James Young, VP of Engineering, FES Si Platform Engineering at Skyworks focused on RF and wireless semiconductor design. In particular he addressed mobile phone design, including PA, ET and APT (Average Power Tracking). He gave performance comparisons and analysis for SOI/CMOS vs. GaAs devices.  (Click here to view the presentation.)

Dr. Yumin Lu, VP of the Shanghai Industrial μTechnology Research Institute Co.,Ltd. elaborated on how 4G wireless communications brings new challenges for RF front-end modules and components. RF-SOI has become a mainstream technology for antenna/switches. There is also significant potential for RF-SOI to make further inroads in applications such as tunable components (including antennas, PAs, filters/duplexers, etc.). (Click here to view the presentation.)

RFSOI_Shanghai14_RoundtableDiscussion

Roundtable Discussion at the 2014 International RF-SOI Workshop in Shanghai

The final panel discussion session on the “China RF market” started a lively debate. Topics included the specificities and drivers of the China RF market, Chinese foundry capacity, the RF-SOI supply chain, RF front-end module (FEM) system packaging and system integration trends, and LTE and WiFi common platforms on RF-SOI substrates.  Audience members had questions about device design. The need for the industry to establish a broader ecosystem was a common theme.

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Editor’s note: This article was first posted in Chinese at Shanghai Institute of Micro-Technology Industry Views. You can see the original hereMany thanks to Xi Wang, Academician and Director General of the Shanghai Institute of Microsystem and Information Technology (SIMIT) /Chinese Academy of Sciences (CAS) for his permission to translate/adapt and reprint it here in ASN.